Electroless Nickel Plating.

1. Ni106 – This is standard solution, comparable with Growel’s Ginplate 418. Gives bright and dark deposits on heating up to 85C. Consist of A, B & C solution. pH of the bath to be maintained at 4.4 with Ammonium Hydroxide. (Please contact us for details)

2. Ni107 – Gives light and bright deposits on heating up to 80C. Consist of A, B, & C solution. A & B for make up and C for maintenance. pH to be maintained at 4.6. (Please contact us for details)

Electroless Copper Plating.

1. Century Cu-703 – this is a high speed bath specially designed for printed circuit boards to give brown deposits. Deposition rate is as high as 2 to 3 microns in 30 seconds. The bath is Cyanide free.

Electroless Tin Plating.

1. Stan-O-dip – this gives instant deposition of tin on copper, MS, zinc, nickel on heating up to 75C. Bath can be replenished with the Stan-o-dip Concentrate. (Technical Data Sheets)

2. EP-50 – A ready-made bath. Especially good for coating of Tin on copper. Instant deposition at temperature 35C.